EXPOSED, SOLDERABLE HEAT SPREADER FOR FLIPCHIP PACKAGES
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United States of America Patent
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N/A
Issued Date -
Feb 4, 2016
app pub date -
Feb 24, 2015
filing date -
Aug 1, 2014
priority date (Note) -
Abandoned
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Abstract
A flipchip package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the flipchip package.
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