DEVICES AND METHODS RELATED TO SUPPORT FOR PACKAGING SUBSTRATE PANEL HAVING CAVITIES
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United States of America Patent
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Feb 4, 2016
app pub date -
Jul 26, 2015
filing date -
Jul 31, 2014
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Abstract
Devices and methods related to support for packaging substrate panel having cavities. In some embodiments, a device for fabricating radio-frequency (RF) modules can include a support plate having a receiving side configured to receive a packaging substrate panel having a plurality of pockets. The receiving side can include a plurality of support features. Each support feature can be dimensioned to fit at least partially into the corresponding pocket and provide support for a portion of the packaging substrate panel associated with the pocket. Among others, such a device can allow formation of an overmold on the side of packaging substrate panel opposite from the pockets, without mechanical deformation of the packaging substrate panel.
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