Solder alloy and joint thereof
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United States of America Patent
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Jun 25, 2019
Grant Date -
Feb 4, 2016
app pub date -
Mar 12, 2014
filing date -
Mar 13, 2013
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Abstract
A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.
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