MULTI-ELECTRODE NEURAL PROTHESIS SYSTEM
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United States of America Patent
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Issued Date -
Feb 4, 2016
app pub date -
Mar 17, 2014
filing date -
Mar 16, 2013
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Abstract
A hermetic electronics package of a multi-electrode neural prosthesis system includes a metal case, a feedthrough construction having an electrically insulating substrate and an array of electrically conductive feedthroughs extending through it, with the electrically insulating substrate connected to the open end of the metal case to form a hermetically sealed enclosure. And a set of electronic components is located within the hermetically sealed enclosure and operably connected to the feedthroughs of the feedthrough construction so as to electrically communicate outside the package. And a demultiplexer is fsoperatively connected to demultiplex a single signal into multiple signals prior to being transmitted through the feedthroughs.
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