A LIQUID COOLED DEVICE ENCLOSURE

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United States of America Patent

APP PUB NO 20160029514A1
SERIAL NO

14434406

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.

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Patent Owner(s)

Patent OwnerAddress
ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETIMEHMET AKIF ERSOY MAHALLESI 296 CADDE NO 16 YENIMAHALLE ANKARA 06370

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ALAKOC, Ugur Ankara, TR 1 5
AYYILMAZ, Tolga Ankara, TR 1 5
KAYNAKOZ, Muharrem Ankara, TR 1 5

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