COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jan 28, 2016
app pub date -
Jan 31, 2014
filing date -
May 14, 2013
priority date (Note) -
Abandoned
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Abstract
To provide copper particulate dispersion capable of forming a conductive film having favorable adhesiveness on an inorganic substrate by photo-sintering. The copper particulate dispersion includes a dispersion vehicle and copper particulates RUM The copper particulates are dispersed into the dispersion vehicle. The copper particulate dispersion includes an adhesion improvement agent for improving adhesiveness between a conductive film formed on a substrate by photo-sintering the copper particulate and the substrate. The substrate is an inorganic substrate. The adhesion improvement agent is a compound containing a phosphorus atom. Thus, the adhesion improvement agent improves adhesiveness between the conductive film and the inorganic substrate.
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