Soldering system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 5, 2017
Issued Date -
N/A
app pub date -
Mar 13, 2013
filing date -
Mar 13, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2013 Application Filing Year
- F24H Class
- 262 Applications Filed
- 223 Patents Issued To-Date
- 85.12 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- F24H Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 5, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 5, 2029 |
