MAGNETRON SPUTTERING GUN ASSEMBLY
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United States of America Patent
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Issued Date -
Jan 28, 2016
app pub date -
Jul 28, 2014
filing date -
Jul 28, 2014
priority date (Note) -
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Abstract
A magnetron sputtering gun device used in vacuum for sputtering to form a thin film, which comprises a magnet copper seat, a magnetic element, a conductive element, a sputtering target, a target fixation assembly, a cylinder-shape protection mask, and a sputtering inclination assembly. By enhancing the magnet copper seat, the magnetron sputtering gun device is equipped with capability of increased film coating speed and increased compound ability between the thin film and the reaction gas. A ferromagnetic material may be coated. The magnet copper seat may be designed so that the sputtering target and strong magnets therewithin may be conveniently detached. In this structure, a cooling water tubing and the strong magnets are separated, lengthening a lifetime of the strong magnets and protecting the strong magnets from demagnetization. The sputtering inclination assembly may further increase a uniformity of the thin film thickness.
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