LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 21, 2016
app pub date -
Jul 17, 2014
filing date -
Jul 17, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to interconnect the component to the printed circuit board. The lead is formed to define an opening through the lead. The lead is placed into the plated thru-hole such that at least part of the opening is within the plated thru-hole. The lead is laser welded to the plated thru-hole.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully