METHOD FOR CLEANING OFF PARTICLES WITHIN CAMERA MODULE AND CAMERA MODULE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 21, 2016
app pub date -
Nov 20, 2014
filing date -
Jul 18, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A camera module includes a sensing chip, a lens module and a gluing element. The gluing element is disposed on the sensing chip and located at a side of the sensing region. The lens module covers the sensing chip. A lens assembly of the lens module is aligned with the sensing region. When the camera module is subject to a vibration, the particles within the camera module are moved to and adsorbed on the gluing element. Consequently, the camera module o can reduce the possibility of falling down the particles on the sensing region.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully