RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC DEVICES, RESIN SHEET FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC DEVICES, ORGANIC ELECTROLUMINESCENT ELEMENT, AND IMAGE DISPLAY DEVICE
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United States of America Patent
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app pub date -
Sep 28, 2015
filing date -
Mar 29, 2013
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Abstract
Provided are a resin composition for element encapsulation for organic electronic devices and other things, which have excellent long-term reliability and excellent visibility by capturing not only the moisture on the front surface or lateral surfaces of the resin composition for element encapsulation for organic electronic devices, but also the moisture permeating through the interior of the resin composition for element encapsulation for organic electronic devices. The resin composition includes a polyisobutylene resin (A) containing a polyisobutylene skeleton in a main chain or in a side chain and having a weight average molecular weight (Mw) of 300,000 or more; and a tackifying agent (B) as main components, includes an organometallic compound (C) having hygroscopic properties, and has a water content of 1000 ppm or less.
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