THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR

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United States of America Patent

APP PUB NO 20160020370A1
SERIAL NO

14336532

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.

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Patent Owner(s)

Patent OwnerAddress
GE LIGHTING SOLUTIONS LLC1975 NOBLE ROAD BLDG 338 NELA PARK EAST CLEVELAND OH 44112

International Classification(s)

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  • 2014 Application Filing Year
  • H01L Class
  • 23828 Applications Filed
  • 21803 Patents Issued To-Date
  • 91.51 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Dengke Willoughby, US 93 273
Jacob, Cherian Brecksville, US 9 264
Lou, Xiaomei Solon, US 8 148
Mayer, Mark J Sagamore Hills, US 46 1140
Saha, Koushik Brunswick, US 24 338
Smith, Gabriel Michael East Cleveland, US 6 39
Ward, Benjamin James Beachwood, US 10 18

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Patent Citation Ranking

  • 5 Citation Count
  • H01L Class
  • 13.47 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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