Edge Termination Using Guard Rings Between Recessed Field Oxide Regions

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United States of America Patent

SERIAL NO

14790991

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Abstract

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An edge termination structure is disclosed. The edge termination structure includes an active cell in a semiconductor wafer, an edge termination region adjacent the active cell in the semiconductor wafer, where the edge termination region includes recessed field oxide regions and guard rings adjacent to the active cell. At least one of the guard rings has a depth greater than a depth of at least one of the recessed field oxide regions. A top surface of each of the recessed field oxide regions is substantially coplanar with a top surface of the semiconductor wafer and with a top surface of each of the guard rings. The recessed field oxide regions may be thermally grown in recesses in the semiconductor wafer. The recessed field oxide regions may include silicon dioxide.

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Patent Owner(s)

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INFINEON TECHNOLOGIES AMERICAS CORP101 N SEPULVEDA BLVD EL SEGUNDO CA 90245

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Limburn, Nicholas Newport, GB 2 7
Ngwendson, Luther-King Newport, GB 6 8
Turner, Russell Monmouthshire, GB 9 22
Vytla, Rajeev Krishna Los Angeles, US 10 21

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