SEALANT COMPOSITION AND SEALING SHEET OBTAINED FROM THE COMPOSITION

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14867790

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/α-olefin copolymer and an ethylene/α-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTDJAPAN TOKYO CHIYODA TOKYO TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOYAMA, Masami Tokyo, JP 19 90
ASANUMA, Takumi Tokyo, JP 15 59
ISHIGURO, Kunihiko Tokyo, JP 9 20
MIEDA, Tetsuya Tokyo, JP 22 50
MIHARA, Naoaki Tokyo, JP 16 75
NAKAMURA, Toshimitsu Tokyo, JP 18 58
SAITO, Keiji Tokyo, JP 60 293

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation