NOVEL INCLUSION COMPOUND
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Mar 24, 2014
filing date -
Mar 25, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An object of the present invention is to provide a novel curing agent or a curing accelerator for epoxy resin. The curing agent or a curing accelerator for epoxy resin of the present invention is a clathrate compound comprising the following (a1) and (a2):
- (a1) a tetrakis(hydroxyphenyl)ethane compound or a carboxylic acid compound represented by formula:
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NIPPON SODA CO LTD | 2-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-8165 |
International Classification(s)

- 2014 Application Filing Year
- C08G Class
- 2377 Applications Filed
- 2099 Patents Issued To-Date
- 88.31 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
NOMURA, Tomoya | Ichihara-shi, JP | 17 | 69 |
# of filed Patents : 17 Total Citations : 69 | |||
ONO, Kazuo | Ichihara-shi, JP | 68 | 648 |
# of filed Patents : 68 Total Citations : 648 |
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Patent Citation Ranking
- 1 Citation Count
- C08G Class
- 26.81 % this patent is cited more than
- 9 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 21, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
- (a1) a tetrakis(hydroxyphenyl)ethane compound or a carboxylic acid compound represented by formula:

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