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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
UNIV FLORIDA STATE RES FOUND	Not Provided

International Classification(s)

• C07F:ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CO....
• C07D:HETEROCYCLIC COMPOUNDS
• C07C:ACYCLIC OR CARBOCYCLIC COMPOUNDS
• C07J:STEROIDS

• 2014 Application Filing Year
• C07F Class
• 1196 Applications Filed
• 979 Patents Issued To-Date
• 81.86 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
CRAN, John W	Tallahassee, US	5	7
# of filed Patents : 5 Total Citations : 7
HAN, Yinglin	Beijing, CN	4	4
# of filed Patents : 4 Total Citations : 4
ZHANG, Faliang	Beijing, CN	27	115
# of filed Patents : 27 Total Citations : 115

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• C07F Class

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Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 21, 2027

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Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2024/0319,458

INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME

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Abstract

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Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.

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Description

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