DIE CUTTING
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United States of America Patent
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Issued Date -
Jan 21, 2016
app pub date -
Jul 14, 2015
filing date -
Jul 16, 2014
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Abstract
A method of die cutting. The method comprises: providing a cutting die (10); providing a work piece (20) to be cut; providing a first polymer film (30) between the cutting-die (10) and the work piece (20); and pressing the cutting die (10) and the work piece (20) together, with the first polymer film (30) between them, to cut the work piece (20). Also provided is a laminate obtainable by said die cutting method and a kit of parts for use in said die cutting method.
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