HEAT DISSIPATING MODULE AND METHOD OF COMBINING THE SAME
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United States of America Patent
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Issued Date -
Jan 14, 2016
app pub date -
Sep 11, 2014
filing date -
Jul 11, 2014
priority date (Note) -
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Abstract
In a heat dissipating module and a method of combining the heat dissipating module, the heat dissipating module includes a circuit board, a heat generating component, a heat dissipating element, and a surface mount layer. The circuit board has a through hole, and the heat generating component is corresponsive to the through hole and installed on the circuit board, and the heat dissipating element has a protruding embedding portion formed on the other side of the circuit board and embedded into the through hole. The surface mount layer is formed on a surface of the circuit board and the internal periphery of the through hole, and the heat generating component and heat dissipating element are combined with both surfaces of the circuit board respectively, and the heat generating component and the embedding portion are contacted with each other through the surface mount layer.
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