Thin Resin Films And Their Use in Layups

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United States of America Patent

APP PUB NO 20160014904A1
SERIAL NO

14795051

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure provides an improved resin film product is comprised of a partially cured b-staged resin film that has a thickness in the range of 1 mils to about 10 mils and that is disposed between two protective layers, as well as methods for their manufacture and use in the production of layups used to manufacture printed circuit boards.

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Patent Owner(s)

Patent OwnerAddress
ISOLA USA CORP3100 WEST RAY ROAD SUITE 301 CHANDLER AS 85226

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schumacher, Johann R Gilbert, US 10 9

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges273132632898442084531501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +010020030040050060070080090010001100120013001400

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