SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20160013301A1
SERIAL NO

14327623

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The semiconductor device includes a first semiconductor layer of a first conductivity type, an insulated gate structure, a first semiconductor region of a second conductivity type, a second semiconductor region of the first conductivity type, and a lightly doped semiconductor region of the second conductivity type. The insulated gate structure is formed in a trench configuration recessed into the first semiconductor layer. The first semiconductor region, the second semiconductor region, and the lightly doped semiconductor region are formed in the first semiconductor layer. The second semiconductor region contacts the first semiconductor region and the insulated gate structure. The second semiconductor region is formed on the lightly doped semiconductor region. The lightly doped semiconductor region is formed between and contacts the first semiconductor region and the insulated gate structure. A method of manufacturing a semiconductor device is also disclosed herein.

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Patent Owner(s)

Patent OwnerAddress
NUVOTON TECHNOLOGY CORPORATIONNO 4 CREATION RD III HSINCHU SCIENCE PARK

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SIDDIQUI, MD Imran Hsinchu, TW 13 52

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