PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
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United States of America Patent
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app pub date -
Dec 8, 2014
filing date -
Jul 11, 2014
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Abandoned
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Abstract
A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a dielectric layer on the carrier; forming a plurality of conductive posts in the dielectric layer; and forming a cavity in the dielectric layer to expose the bonding pads, wherein the conductive posts are positioned around a periphery of the cavity, thereby simplifying the fabrication process.
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