THERMAL IMAGING SYSTEMS WITH VACUUM-SEALING LENS CAP AND ASSOCIATED WAFER-LEVEL MANUFACTURING METHODS
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United States of America Patent
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Issued Date -
Jan 14, 2016
app pub date -
Jul 11, 2014
filing date -
Jul 11, 2014
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Abandoned
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Abstract
A thermal imaging system with a vacuum-sealing lens cap, includes (a) a thermal image sensor having an array of temperature sensitive pixels for detecting thermal radiation, and (b) a lens sealed to the thermal image sensor for imaging thermal radiation from a scene onto the array of temperature sensitive pixels and sealing a vacuum around the temperature sensitive pixels. A wafer-level method for manufacturing a thermal imaging system with a vacuum-sealing lens cap includes sealing a lens wafer, having a plurality of lenses, to a sensor wafer having a plurality of thermal image sensors each having an array of temperature sensitive pixels, to seal, for each of the plurality of thermal image sensors, a vacuum around the temperature sensitive pixels.
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