Electronic device with laminated structure and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 23, 2021
Grant Date -
Jan 14, 2016
app pub date -
Sep 21, 2015
filing date -
Oct 15, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates; thereby making an electronic device more firm with higher shock resistance.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully