COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jan 7, 2016
app pub date -
Jan 31, 2014
filing date -
May 15, 2013
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Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. A copper particulate dispersion includes a dispersion vehicle and copper particulates dispersed in the dispersion vehicle. The copper particulate dispersion contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates during the photo-sintering of the copper particulates.
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