CIRCUIT SUBSTRATE AND PROCESS FOR PREPARING THE SAME
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United States of America Patent
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Jan 7, 2016
app pub date -
Feb 19, 2014
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Jan 14, 2014
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Abstract
The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.
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