ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

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United States of America Patent

SERIAL NO

14754903

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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To provide an electronic component having a protective film formed with a good uniformity, over the entire surface thereof. An aspect of the present invention is an electronic component having a protective film formed over the entire surface thereof, the electronic component has elements and wirings formed on a base body, and the protective film has been formed by a CVD method, over an entire surface of said electronic component, by: arranging an electrode in a chamber; grounding one side of the chamber and the electrode; accommodating the electronic component in the chamber; supplying an raw material gas to the chamber; rotating or swinging the chamber and thereby moving the electronic component in the chamber; supplying high-frequency power to the other side of the chamber and the electrode; and generating a raw-material-gas-based plasma between the electrode and the chamber.

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Patent Owner(s)

Patent OwnerAddress
YOUTEC CO LTDCHIBA COUNTY JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HONDA, Yuuji Chiba, JP 53 491
MIKAMI, Yukari Chiba, JP 2 3
OKUDAIRA, Kohei Chiba, JP 3 4

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  • 3 Citation Count
  • H01L Class
  • 13.47 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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