INTEGRATED CIRCUIT ASSEMBLY AND INTEGRATED CIRCUIT PACKAGING STRUCTURE
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United States of America Patent
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Issued Date -
Jan 7, 2016
app pub date -
Oct 22, 2014
filing date -
Jul 4, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit packaging structure includes a chip, an electrical bump, a heat dissipation bump, a lead frame, and a sealant. The chip includes an active surface and an electronic component that is formed by using a semiconductor process. The electrical bump is electrically connected to the electronic component through the active surface. The heat dissipation bump is connected to the active surface. The lead frame is electrically connected to the electrical bump. The sealant covers the chip, the lead frame, and the electrical bump, wherein the heat dissipation bump and a part of the lead frame are exposed without being covered. The height of the heat dissipation bump relative to the active surface is unequal to that of the electrical bump relative to the active surface.
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