METHOD FOR FORMING ELECTRONIC ELEMENT

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United States of America Patent

APP PUB NO 20160005514A1
SERIAL NO

14324888

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a method for forming an electronic element. The method for forming an electronic element comprises: providing a first substrate comprising a compound comprising a metallic element and a non-metallic element; performing a first treatment by a laser radiation in a first region of the first substrate; and forming a first electrically conductive layer in the first region radiated by the laser.

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Patent Owner(s)

Patent OwnerAddress
EPISTAR CORPORATIONHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Po-Chang Taipei, TW 55 156
KUO, Jai-Tai Taipei, TW 16 31
SUNG, Yu-Hsi Taipei, TW 3 9

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