POLYAMIDE-BASED RESIN FILM
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United States of America Patent
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Jan 7, 2016
app pub date -
Feb 25, 2014
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Mar 11, 2013
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Abstract
The invention provides a biaxially oriented polyamide-based resin film, which contains a polyamide resin and 1 to 5% by mass of a polyamide-based block copolymer, and which is laminated with an adhesion-modifying layer containing a copolymerized polyester on at least one surface thereof. The polyamide-based block copolymer contains a hard constituent of a cyclic lactam residue having 4 to 10 carbon atoms and a soft constituent of a residue of a polyoxypropylene glycol or a polyoxytetramethylene glycol having a number average molecular weight of 500 to 3000. The content X of the hard constituent, the content Y of the soft constituent, and the number average molecular weight Mn of the soft constituent satisfy equations (1) X+Y=100 (parts by mass) and (2) 478.74×Mn−0.2989≦Y≦93 (parts by mass).
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