METALLIZED FILM-OVER-FOAM CONTACTS
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United States of America Patent
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Issued Date -
Dec 31, 2015
app pub date -
Sep 3, 2015
filing date -
Jul 28, 2012
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Abstract
A contact suitable for circuit grounding of surface mount technology devices generally includes a resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
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