PRE-APPLIED CONDUCTIVE ADHESIVE FOR EMI SHIELDING
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United States of America Patent
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Issued Date -
Dec 31, 2015
app pub date -
Mar 13, 2014
filing date -
Feb 25, 2013
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Abstract
A method for providing EMI shielding to an electronic circuit board using an electrically-conductive thermoplastic sheet containing a pre-applied electrically-conductive adhesive composition is disclosed. The adhesive composition is fluent and form-stable, and comprises a silicone adhesive, a compatible silane and electrically-conductive particles or fibers. The adhesive is conveniently pre-applied to the thermoplastic sheet and shipped to the customer for attachment to the integrated circuit board.
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