METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND SUBSTRATE FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Dec 31, 2015
app pub date -
Dec 28, 2012
filing date -
Dec 28, 2012
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Abstract
The present invention relates to the field of electronic device fabrication, provides a method for fabricating a flexible electronic device, and is intended to address the problems present in the prior art that the adhesive cannot be completely peeled off and the flexible substrate is damaged during peeling the flexible substrate from the rigid substrate in the flexible electronic device fabrication. The fabrication method comprises providing a channel on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channel; and reacting the chemical substance with the adhesive, and peeling the flexible substrate from the rigid substrate. The present invention also provides a substrate for fabricating a flexible electronic device. In the present invention, a channel is provided on the rigid substrate to enhance the efficiency and speed of the reaction between the chemical substance with the adhesive, so that the flexible substrate can be completely and automatically peeled from the rigid substrate rapidly, and the chemical substance which reacts with the adhesive will not cause a damage to the flexible substrate or the electronic device.
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