Vacuum chuck with polymeric embossments
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United States of America Patent
Stats
-
Aug 4, 2020
Grant Date -
Dec 31, 2015
app pub date -
Feb 11, 2014
filing date -
Feb 13, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
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International Classification(s)
- 2014 Application Filing Year
- H01L Class
- 23828 Applications Filed
- 21803 Patents Issued To-Date
- 91.51 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 4, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 4, 2032 |
