Monitoring Apparatus and Related Methods
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United States of America Patent
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Issued Date -
Dec 31, 2015
app pub date -
Jun 25, 2014
filing date -
Jun 25, 2014
priority date (Note) -
Abandoned
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Abstract
A monitoring apparatus and related methods is disclosed. The monitoring apparatus includes a banding structure. The banding structure is connectable to a housing. At least one non-wired, conductive element is connected to the banding structure and positioned along a length of the banding structure, wherein the at least one non-wired, conductive element is connected to form a circuit through the housing. A cut-band detection element is in communication with the circuit, wherein the cut-band detection element detects a break in the circuit.
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