TEST SOCKET WITH HIGH DENSITY CONDUCTION SECTION

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150377923A1
SERIAL NO

14766002

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a test socket having high-density conduction sections. The test socket is configured to be disposed between a device to be tested and a test apparatus for electrically connecting terminals of the device and pads of the test apparatus. The test socket includes: an elastic conductive sheet including first conduction sections and an insulative support section, the first conduction sections being disposed at positions corresponding to the terminals of the device and formed by arranging a plurality of first conductive particles in an elastic material in a thickness direction of the first conduction sections, the insulative support section supporting the first conduction sections and insulating the first conduction sections from each other; a support sheet attached to a top surface of the elastic conductive sheet and including penetration holes at positions corresponding to the terminals of the device; and second conduction sections disposed in the penetration holes of the support sheet and formed by arranging a plurality of second conductive particles in an elastic material in a thickness direction of the second conduction sections. The second conductive particles are arranged more densely than the first conductive particles, and the penetration holes have an upper diameter that is greater than a lower diameter thereof.

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Patent Owner(s)

Patent OwnerAddress
ISC CO LTD26 GEUMTO-RO 40BEON-GIL SUJEONG-GU SEONGNAM-SI GYEONGGI-DO 13217 13217

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Jae Hak Seongnam-si, KR 90 380

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