Pressure Sensor System

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United States of America Patent

SERIAL NO

14767044

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

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Patent Owner(s)

Patent OwnerAddress
EPCOS AGMUNICH GERMANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BOHL, Benjamin Berlin, DE 12 15
HUNDERTMARK, Bert Berlin, DE 5 7
IHLE, Jan Grambach, AT 43 119
OSTRICK, Bernhard Teltow, DE 16 53
PESCHKA, Andreas Michendorf, DE 5 19

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