METHOD FOR PRODUCING HEXAGONAL SINGLE CRYSTAL, METHOD FOR PRODUCING HEXAGONAL SINGLE CRYSTAL WAFER, HEXAGONAL SINGLE CRYSTAL WAFER, AND HEXAGONAL SINGLE CRYSTAL ELEMENT

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United States of America Patent

APP PUB NO 20150376813A1
SERIAL NO

14765092

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When growing a hexagonal single crystal, an off angle is set, in a first direction [11-20] with respect to a basal plane {0001} serving as a main crystal growth plane, in a hexagonal single crystal for use as a foundation in performing crystal growth; and a cross-sectional shape which is decreased in crystal thickness in a stair-step manner from a reference line AA′ parallel to the first direction [11-20] toward second directions [−1100], [1-100] on both sides of the reference line and orthogonal to the first direction [11-20]. Dislocations threading in a c-axis direction, contained in the hexagonal single crystal, are converted into defects inclined ≧40° from the c-axis direction toward the basal plane during crystal growth, and the direction of propagation of the defects is controlled to a direction between a direction [−1-120] opposite to the first direction [11-20] and the second directions [−1100], [1-100], to discharge defects.

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Patent Owner(s)

Patent OwnerAddress
CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY6-1 OHTEMACHI 1-CHOME CHIYODA-KU TOKYO 100-8126

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Inventor Name Address # of filed Patents Total Citations
HOSHINO, Norihiro Kanagawa, JP 10 18
KAMATA, Isaho Kanagawa, JP 36 242
TSUCHIDA, Hidekazu Kanagawa, JP 56 391

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