PRE-APPLIED UNDERFILL
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United States of America Patent
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Issued Date -
Dec 24, 2015
app pub date -
Jun 23, 2014
filing date -
Jun 23, 2014
priority date (Note) -
Abandoned
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Abstract
Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
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