METHOD OF FORMING PATTERN
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United States of America Patent
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Issued Date -
Dec 24, 2015
app pub date -
Sep 26, 2014
filing date -
Jun 20, 2014
priority date (Note) -
Abandoned
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Abstract
A method of forming a pattern including following steps is provided. A wafer is provided, wherein the wafer includes a plurality of wafer interior dies and a plurality of wafer edge dies. A first pattern is formed on each of the wafer interior dies, and a second pattern is formed on each of the wafer edge dies. A method of forming the first patterns includes performing at least two exposure processes, and a method of forming the second patterns includes performing at least one of the at least two exposure processes, wherein a number of the exposure processes performed for forming the second patterns is less than a number of the exposure processes performed for forming the first patterns.
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