HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
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United States of America Patent
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Dec 24, 2015
app pub date -
Jul 22, 2014
filing date -
Oct 24, 2013
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Abstract
A heat dissipation circuit board comprises a printed circuit board including an insulating film disposed at a back surface and one or more land parts disposed at a front surface, one or more electronic components mounted on the one or more land parts, and an adhesive layer stacked on a back surface of the insulating film. The insulating film and the adhesive layer are removed in a first region that covers at least projection regions of the one or more land parts for each of the electronic components, and removed portions of the insulating film and the adhesive layer are filled with a thermally conductive adhesive.
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