METAL ETCHANT COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME

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United States of America Patent

APP PUB NO 20150368557A1
SERIAL NO

14312043

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Abstract

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The present inventive concepts provide metal etchant compositions and methods of fabricating a semiconductor device using the same. The metal etchant composition includes an organic peroxide in a range of about 0.1 wt % to about 20 wt %, an organic acid in a range of about 0.1 wt % to about 70 wt %, and an alcohol-based solvent in a range of about 10 wt % to about 99.8 wt %. The metal etchant composition may be used in an anhydrous system.

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Patent Owner(s)

Patent OwnerAddress
CORNELL UNIVERSITY395 PINE TREE ROAD SUITE 310 ITHACA NY 14850
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Jihoon Suwon-si, KR 49 216
Kim, Kyoungseob Suwon-si, KR 15 82
Ko, Yongsun Suwon-si, KR 33 215
Lee, Hyosan Hwaseong-si, KR 47 526
Lee, Kuntack Suwon-si, KR 73 881
Lin, Chen Ithaca, US 78 182
Ober, Christopher K Ithaca, US 59 893

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