RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE

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United States of America Patent

APP PUB NO 20150368435A1
SERIAL NO

14767305

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Abstract

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A resin composition containing aluminum nitride particles, a heat-curable resin or a thermoplastic resin, and an alkyl acid phosphate having a specific structure is produced by mixing the aluminum nitride particles, the heat-curable resin or thermoplastic resin, and the alkyl acid phosphate having the specific structure. Molding and curing the resin composition make it possible to obtain a resin-molded article having high thermal conductivity.

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Patent Owner(s)

Patent OwnerAddress
TOKUYAMA CORPORATIONYAMAGUCHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohno, Hideki Yamaguchi, JP 20 386

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