METHOD OF USING LASER ABLATION TO REVEAL UNDERLYING SECURITY FEATURE AND DEVICE OBTAINED THEREBY
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United States of America Patent
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Issued Date -
Dec 24, 2015
app pub date -
Mar 7, 2013
filing date -
Mar 7, 2013
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Abstract
A credential with one or more security features is disclosed. The disclosed credential includes a thin-film metal layer that can be utilized as a recording media. The thin-film metal layer may also have portions thereof removed to reveal at least one underlying layer, such as a photoreactive layer. A method of manufacturing such a credential is also disclosed.
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