CHEMICAL MECHANICAL POLISHING CONDITIONER
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United States of America Patent
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N/A
Issued Date -
Dec 24, 2015
app pub date -
May 26, 2015
filing date -
Jun 18, 2014
priority date (Note) -
Abandoned
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Abstract
Provided is a CMP conditioner comprising: a substrate comprising multiple concave parts, the concave parts formed in a surface of the substrate and each concave part having a side wall; multiple fixed plates, each fixed plate comprising a bottom, a top, a concavity and an inclined plane, the bottom fixed into the concave part, the top integrated with the bottom with a contact surface formed between the top and the bottom, the concavity formed in the top and opposite the bottom, the inclined plane formed between the contact surface and the concavity, an angle and a space formed between the inclined plane and the side wall; and multiple abrasive units, each abrasive unit mounted in the concavity. When the CMP conditioner is applied to a pad, the thickness of the pad can recover to its original thickness; i.e., the cutting depth is increased to improve the dressing performance.
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