WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Dec 17, 2015
app pub date -
Jun 16, 2015
filing date -
Jun 17, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wiring substrate includes a first substrate to be connected to a second substrate. Electrodes are disposed on a substrate main surface of the first substrate, and columnar terminals are bonded onto the electrodes via solder portions. Each columnar terminal includes a columnar terminal body, and a projecting piece that projects from an outer peripheral surface of the columnar terminal body at a center portion, in a height direction, of the outer peripheral surface of the columnar terminal body. Each columnar terminal has a shape vertically symmetrical about the projecting piece.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NGK SPARK PLUG CO LTD | 14-18 TAKATSUJI-CHO MIZUHO-KU NAGOYA-SHI AICHI 467-8525 |
International Classification(s)

- 2015 Application Filing Year
- B23K Class
- 2354 Applications Filed
- 1765 Patents Issued To-Date
- 74.98 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
HANDO, Takuya | Inuyama-shi, JP | 17 | 131 |
# of filed Patents : 17 Total Citations : 131 | |||
SUGIMOTO, Atsuhiko | Kakamigahara-shi, JP | 23 | 155 |
# of filed Patents : 23 Total Citations : 155 |
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Patent Citation Ranking
- 1 Citation Count
- B23K Class
- 13.67 % this patent is cited more than
- 10 Age
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- No Forward Cites to Display

Maintenance Fees
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 17, 2027 |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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