WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

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United States of America Patent

APP PUB NO 20150366058A1
SERIAL NO

14741174

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wiring substrate includes a first substrate to be connected to a second substrate. Electrodes are disposed on a substrate main surface of the first substrate, and columnar terminals are bonded onto the electrodes via solder portions. Each columnar terminal includes a columnar terminal body, and a projecting piece that projects from an outer peripheral surface of the columnar terminal body at a center portion, in a height direction, of the outer peripheral surface of the columnar terminal body. Each columnar terminal has a shape vertically symmetrical about the projecting piece.

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Patent Owner(s)

Patent OwnerAddress
NGK SPARK PLUG CO LTD14-18 TAKATSUJI-CHO MIZUHO-KU NAGOYA-SHI AICHI 467-8525

International Classification(s)

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  • 2015 Application Filing Year
  • B23K Class
  • 2354 Applications Filed
  • 1765 Patents Issued To-Date
  • 74.98 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HANDO, Takuya Inuyama-shi, JP 17 131
SUGIMOTO, Atsuhiko Kakamigahara-shi, JP 23 155

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Patent Citation Ranking

  • 1 Citation Count
  • B23K Class
  • 13.67 % this patent is cited more than
  • 10 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1487741152783331101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7091 - 100100 +050100150200250300350400450500550600650700750800850

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