HIGH FREQUENCY MODULE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 17, 2015
app pub date -
Apr 24, 2015
filing date -
Jun 11, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A high frequency module includes a wiring substrate and a metal shield cover. A wiring conductor through which a high frequency signal is transferred and which is coupled to the electronic component, a wiring electrode which is coupled to the wiring conductor and is provided in an outside further than the shield cover, and a ground electrode which is coupled to the shield cover, are provided on the wiring substrate. The shield cover includes a side plate which is formed of a metal of a plate shape, and a leg portion which is provided in the side plate and is soldered to the ground electrode. A gap is formed between the side plate and the wiring substrate, and the wiring conductor is disposed so as to intersect the side plate in a planar view, on the wiring substrate which is positioned below the gap.
First Claim
Other Claims data not available