Flip-Chip Light Emitting Diode Assembly With Relief Channel
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United States of America Patent
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Issued Date -
Dec 17, 2015
app pub date -
Jun 12, 2014
filing date -
Jun 12, 2014
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Abstract
A flip-chip LED assembly with relief channel and a method for making the flip-chip LED assembly is disclosed. In one embodiment, the flip-chip LED assembly includes a flip-chip LED with a via and a channel formed in the surface of the flip-chip LED. The channel extends from the via to a sidewall of the flip-chip LED. In another embodiment, a plurality of vias and a plurality of channels are formed in the surface of the flip-chip LED. Each of the plurality of channels extend from each of the vias to another via, or to a sidewall of the flip-chip LED.
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