Wafer Loading and Unloading
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United States of America Patent
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Issued Date -
Dec 17, 2015
app pub date -
Jun 11, 2014
filing date -
Jun 11, 2014
priority date (Note) -
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Abstract
A robotic handling system loads and unloads wafers (e.g., silicon wafers) and their carriers into and out of an interlock chamber of a loadlock system. The wafer handling system includes an end effector that handles both the wafer and the carrier by their bottom surfaces, avoiding contact with the top surface of the wafer. From the interlock chamber, wafers, seated on the carrier, are moved into a processing chamber under vacuum conditions. Processed wafers, seated on the carrier, are moved from the processing chamber back into the interlock chamber and removed from the interlock chamber by the robotic handling system under atmospheric conditions.
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