DETERMINING PRESENCE OF CONDUCTIVE FILM ON DIELECTRIC SURFACE OF REACTION CHAMBER
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United States of America Patent
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Dec 17, 2015
app pub date -
Jun 16, 2014
filing date -
Jun 16, 2014
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In one aspect, a plasma system includes a dielectric enclosure enclosing a portion of a reaction chamber, a conductive coil extending along a perimeter of the enclosure, and a generator for providing a first electrical signal to the coil to cause a plasma to be generated in the reaction chamber. The system additionally includes a probe located within the reaction chamber, a sensing device for sensing a second electrical signal generated in the probe via the plasma while the first electrical signal is provided to the coil, and a processing unit for determining a metric based on the sensed second electrical signal, the metric indicating a measure of deposition or removal of a conductive material on an inside surface of the enclosure.
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