METHOD OF HEAT TRANSFER IN POWER ELECTRONICS APPLICATIONS
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United States of America Patent
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Dec 10, 2015
app pub date -
Jun 9, 2015
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Jun 10, 2014
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Abstract
An exemplary method of heat transfer in power electronics applications is disclosed, wherein a metal foil including at least about 50% of tin, based on a total amount of metals contained in the metal foil, is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. The metal foil is disposed on a heat sink. A base plate of a heat generating component or module is disposed on the heat sink covered by the metal foil to provide a power electronics device. A clamping force is applied to the power electronics assembly to provide a cooled power electronics assembly.
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